YHY YOUNG HE ELECTRONIC
TECHNOLOGY CO., LIMITED

 


 

Item   Capability     
Layer   1-24 layers     
Base material      CEM-1, CEM-3, FR-1, FR-2, FR4, FR4TG150, FR4TG170/180, Rogers ,Teflon,
Halogen Free material, Aluminium , ISOLA , TACONIC,Polyimide  
Material brand  ShengYi ,NanYa,ITEQ,KB,GDM,GRACE   
Final board thickness   0.2 mm - 5.0 mm     
Surface treatment     OSP, HASL,HASL Lead free, Immersion gold, Immersion Tin, Immersion silver, 
Hard gold plating, Gold fingers,Flash gold ;    
Max.panel size  24 Inch (610 mm) x 27 Inch ( 686mm)    
Min.Trace width  3 mils( 0.075mm )      
Min Trace spacing  3 mils( 0.075mm )     
Max.copper thickness  12 oz      
Mechanical Drilling Bit size 7.8 mils (0.2 mm) - 236.2 mils (6.0mm)   
Finished holes size by CNC 4.0 mils (0.1 mm) - 234.2 mils (5.95mm)   
Hole size tolerance by CNC PTH +/-3 mils(+/- 0.075 mm), NPTH +/-2 mils (+/- 0.05mm) 
Hole position tolerance by CNC +/- 2 mils (+/- 0.05 mm)     
Aspect ratio  12:1      
Min.solder mask dam (Bridage) 3 mils (0.075 mm)     
Min Impedance control tolerance +/-5%, normal with +/- 10%     
Solder mask colour  Green ,Red ,Yellow, Black, White ,Matt green ,matt Black, etc.. 
Min pad ring  4 mils (0.1 mm)     
Bow and warp     <= 1%      
CNC  <= 100mm +/-4 mils (+/-0.1 mm), 100 mm -300 mm +/-5.9 mils( +/- 0.15 mm)
Outline tolerance           >300 mm +/-8mils (+/- 0.2 mm)    
Laser cutting +/-2mils ( +/- 0.05mm), Min. +/-1mils (+/-0.025mm) for special
Immersion gold => Ni 3-5um(118u"-197 u"), Au 0.025um-0.1um ( 1u"-4u")
Hard gold plating => Ni 3-5um(120u"-200 u"), Au  0.25um-1.5um ( 10u"- 59u")
Plating thickness           Flash gold => Ni 3-6 um (120u"-250u"), Au 0.025um-0.127 um ( 1u"-5u")
Immersion Tin => 0.8-1.5 um ( 31.5 u" - 59 u")   
Immersion silver => 0.1-0.3um ( 4-12 u")   
OSP => 0.2-0.5 um ( 8-10u")